Soldering Handbook For Printed Circuits And Surface Mounting

Author : Howard H. Manko
Publisher : Springer Science & Business Media
ISBN 13 : 9780442012069
Total Pages : 548 pages
Book Rating : 4.63/5 ( download)

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Download or read book Soldering Handbook For Printed Circuits and Surface Mounting written by Howard H. Manko and published by Springer Science & Business Media. This book was released on 1995-10-31 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

Author : Howard H. Manko
Publisher : Springer
ISBN 13 :
Total Pages : 456 pages
Book Rating : 4.95/5 ( download)

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Download or read book Soldering Handbook for Printed Circuits and Surface Mounting written by Howard H. Manko and published by Springer. This book was released on 1986-11-30 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.

Author : Howard M. Manko
Publisher : Springer
ISBN 13 : 9781461578741
Total Pages : 0 pages
Book Rating : 4.44/5 ( download)

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Download or read book Soldering Handbook for Printed Circuits and Surface Mounting written by Howard M. Manko and published by Springer. This book was released on 1986-11-15 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.

Author : Clyde F. Coombs
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 994 pages
Book Rating : 4.96/5 ( download)

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Download or read book Printed Circuits Handbook written by Clyde F. Coombs and published by McGraw-Hill Companies. This book was released on 1988 with total page 994 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Clyde Coombs
Publisher : McGraw Hill Professional
ISBN 13 : 0071467343
Total Pages : 1634 pages
Book Rating : 4.46/5 ( download)

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Download or read book Printed Circuits Handbook written by Clyde Coombs and published by McGraw Hill Professional. This book was released on 2007-08-29 with total page 1634 pages. Available in PDF, EPUB and Kindle. Book excerpt: The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing! The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits. Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits Inside This State-of-the-Art Printed Circuits Guide • Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits

Author : RUDOLF STRAUSS
Publisher : Elsevier
ISBN 13 : 9780080480978
Total Pages : 400 pages
Book Rating : 4.77/5 ( download)

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Download or read book SMT Soldering Handbook written by RUDOLF STRAUSS and published by Elsevier. This book was released on 1998-02-24 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology

Author : Keith Brindley
Publisher : Elsevier
ISBN 13 : 1483105377
Total Pages : 354 pages
Book Rating : 4.76/5 ( download)

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Download or read book Newnes Electronics Assembly Handbook written by Keith Brindley and published by Elsevier. This book was released on 2016-06-30 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Newnes Electronics Assembly Handbook

Author : John H. Lau
Publisher : Springer
ISBN 13 :
Total Pages : 732 pages
Book Rating : 4.96/5 ( download)

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Download or read book Handbook of Fine Pitch Surface Mount Technology written by John H. Lau and published by Springer. This book was released on 1994 with total page 732 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

Author : Frank Riley
Publisher : Springer Science & Business Media
ISBN 13 : 3662131617
Total Pages : 576 pages
Book Rating : 4.19/5 ( download)

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Download or read book The Electronics Assembly Handbook written by Frank Riley and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Author : Indium Corporation
Publisher :
ISBN 13 : 9781737023289
Total Pages : pages
Book Rating : 4.88/5 ( download)

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Download or read book The Printed Circuit Assembler's Guide To... Solder Defects written by Indium Corporation and published by . This book was released on 2021-11-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.