Heat Transfer In Microelectronic Equipment

Author : Lian-Tuu Yeh
Publisher : American Society of Mechanical Engineers
ISBN 13 :
Total Pages : 456 pages
Book Rating : 4.55/5 ( download)

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Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Author : John H. Seely
Publisher : Marcel Dekker
ISBN 13 : 9780824716110
Total Pages : 362 pages
Book Rating : 4.16/5 ( download)

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Download or read book Heat Transfer in Microelectronic Equipment written by John H. Seely and published by Marcel Dekker. This book was released on 1972 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : John H. Seely
Publisher :
ISBN 13 : 9780608302782
Total Pages : 357 pages
Book Rating : 4.83/5 ( download)

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Download or read book Heat Transfer in Microelectronic Equipment written by John H. Seely and published by . This book was released on 1972 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Madhusudan Iyengar
Publisher : World Scientific
ISBN 13 : 9814579807
Total Pages : 471 pages
Book Rating : 4.03/5 ( download)

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Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Author : Sadik Kakaç
Publisher : Springer Science & Business Media
ISBN 13 : 9401110905
Total Pages : 953 pages
Book Rating : 4.07/5 ( download)

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Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Author : John H. Seely
Publisher :
ISBN 13 :
Total Pages : 350 pages
Book Rating : 4.53/5 ( download)

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Download or read book HEAT TRANSFER IN MICROELECTRONIC EQUIPMENT : A PRACT. GUIDE written by John H. Seely and published by . This book was released on 1984 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441977597
Total Pages : 633 pages
Book Rating : 4.95/5 ( download)

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Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Author : Stephen S. Furkay
Publisher :
ISBN 13 :
Total Pages : 396 pages
Book Rating : 4.43/5 ( download)

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Download or read book Thermal Management Concepts in Microelectronic Packaging written by Stephen S. Furkay and published by . This book was released on 1984 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : A. E. Bergles
Publisher : CRC Press
ISBN 13 : 9780891162773
Total Pages : 1048 pages
Book Rating : 4.71/5 ( download)

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Download or read book Heat Transfer In Electronic And Microelectronic Equipment written by A. E. Bergles and published by CRC Press. This book was released on 1990-03-01 with total page 1048 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examining one of the major heat transfer issues of the decade, this reference volume presents new contributions from international researchers. The volume contains information on thermal control of devices from microelectronic chips in computers to devices for power conversion.

Author : Sung Jin Kim
Publisher : CRC Press
ISBN 13 : 1000151743
Total Pages : 264 pages
Book Rating : 4.49/5 ( download)

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Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.