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ISBN 13 : 9781728168265
Total Pages : pages
Book Rating : 4.60/5 ( download)
Download or read book 2020 21st International Conference on Electronic Packaging Technology (ICEPT). written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9781665413916
Total Pages : pages
Book Rating : 4.13/5 ( download)
Download or read book 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9781665499057
Total Pages : 0 pages
Book Rating : 4.52/5 ( download)
Download or read book "2022 23rd International Conference on Electronic Packaging Technology (ICEPT)". written by and published by . This book was released on with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781479904990
Total Pages : pages
Book Rating : 4.96/5 ( download)
Download or read book 2013 14th International Conference on Electronic Packaging Technology (ICEPT) written by IEEE Staff and published by . This book was released on 2013-08-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 9811992673
Total Pages : 873 pages
Book Rating : 4.74/5 ( download)
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Author : Shenglin Ma
Publisher : Elsevier
ISBN 13 : 0323996035
Total Pages : 294 pages
Book Rating : 4.37/5 ( download)
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology
Author : Shanben Chen
Publisher : Springer Nature
ISBN 13 : 9819996295
Total Pages : 155 pages
Book Rating : 4.92/5 ( download)
Download or read book Transactions on Intelligent Welding Manufacturing written by Shanben Chen and published by Springer Nature. This book was released on 2024-01-13 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary aim of this book is to provide researchers and engineers from both academic and industry with up-to-date coverage of new results in the field of robotic welding, intelligent systems and automation. The book is mainly based on papers selected from the 2022 International Conference on Robotic Welding, Intelligence and Automation (RWIA’2022) in Shanghai and Lanzhou, China. The articles show that the intelligentized welding manufacturing (IWM) is becoming an inevitable trend with the intelligentized robotic welding as the key technology. The volume is divided into four logical parts: Intelligent Techniques for Robotic Welding, Sensing of Arc Welding Processing, Modeling and Intelligent Control of Welding Processing, as well as Intelligent Control and its Applications in Engineering.
Author : Sanjay Yadav
Publisher : Springer Nature
ISBN 13 : 9811901082
Total Pages : 574 pages
Book Rating : 4.89/5 ( download)
Download or read book Proceedings of Second International Conference in Mechanical and Energy Technology written by Sanjay Yadav and published by Springer Nature. This book was released on 2022-06-26 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected peer-reviewed papers from the International Conference on Mechanical and Energy Technologies, which was held on October 28–29, 2021, at Galgotias College of Engineering and Technology, Greater Noida, India. The book reports on the latest developments in the field of mechanical and energy technology in contributions prepared by experts from academia and industry. The broad range of topics covered includes aerodynamics and fluid mechanics, artificial intelligence, nonmaterial and nonmanufacturing technologies, rapid manufacturing technologies and prototyping, remanufacturing, renewable energies technologies, metrology and computer-aided inspection, etc. Accordingly, the book offers a valuable resource for researchers in various fields, especially mechanical and industrial engineering, and energy technologies.
Author : IEEE Staff
Publisher :
ISBN 13 : 9781509013975
Total Pages : pages
Book Rating : 4.70/5 ( download)
Download or read book 2016 17th International Conference on Electronic Packaging Technology (ICEPT) written by IEEE Staff and published by . This book was released on 2016-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2016 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
Author : Celestine Iwendi
Publisher : Frontiers Media SA
ISBN 13 : 2832515754
Total Pages : 1365 pages
Book Rating : 4.54/5 ( download)
Download or read book Big data analytics for smart healthcare applications written by Celestine Iwendi and published by Frontiers Media SA. This book was released on 2023-04-17 with total page 1365 pages. Available in PDF, EPUB and Kindle. Book excerpt:
