Ulsi Process Integration 5

Author : Cor L. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1566775728
Total Pages : 509 pages
Book Rating : 4.24/5 ( download)

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Download or read book ULSI Process Integration 5 written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2007 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.

Author : C. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1566777445
Total Pages : 547 pages
Book Rating : 4.45/5 ( download)

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Download or read book ULSI Process Integration 6 written by C. Claeys and published by The Electrochemical Society. This book was released on 2009-09 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

Author : Cor L. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 9781566772419
Total Pages : 408 pages
Book Rating : 4.19/5 ( download)

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Download or read book ULSI Process Integration written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 1999 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Cor L. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 9781566773089
Total Pages : 636 pages
Book Rating : 4.83/5 ( download)

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Download or read book ULSI Process Integration II written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2001 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : C. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1607682613
Total Pages : 429 pages
Book Rating : 4.15/5 ( download)

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Download or read book ULSI Process Integration 7 written by C. Claeys and published by The Electrochemical Society. This book was released on 2011 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : C. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1607686759
Total Pages : 335 pages
Book Rating : 4.50/5 ( download)

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Download or read book ULSI Process Integration 9 written by C. Claeys and published by The Electrochemical Society. This book was released on 2015 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
ISBN 13 : 9781566773768
Total Pages : 620 pages
Book Rating : 4.68/5 ( download)

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Download or read book ULSI Process Integration III written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2003 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.69/5 ( download)

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Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Author : D. Harame
Publisher : The Electrochemical Society
ISBN 13 : 1566778255
Total Pages : 1066 pages
Book Rating : 4.51/5 ( download)

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Download or read book SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices written by D. Harame and published by The Electrochemical Society. This book was released on 2010-10 with total page 1066 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

Author : Chih-Hang Tung
Publisher : John Wiley & Sons
ISBN 13 : 9780471457725
Total Pages : 688 pages
Book Rating : 4.28/5 ( download)

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Download or read book ULSI Semiconductor Technology Atlas written by Chih-Hang Tung and published by John Wiley & Sons. This book was released on 2003-10-06 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs