Low Dielectric Constant Materials For Ic Applications

Author : Paul S. Ho
Publisher : Springer Science & Business Media
ISBN 13 : 3642559085
Total Pages : 323 pages
Book Rating : 4.82/5 ( download)

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Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

Author : Hari Singh Nalwa
Publisher : Elsevier
ISBN 13 : 0080533531
Total Pages : 1108 pages
Book Rating : 4.37/5 ( download)

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Download or read book Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set written by Hari Singh Nalwa and published by Elsevier. This book was released on 1999-09-07 with total page 1108 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.

Author : Hari Singh Nalwa
Publisher : Academic Press
ISBN 13 : 9780125139076
Total Pages : 0 pages
Book Rating : 4.71/5 ( download)

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Download or read book LOW & HIGH DIELECTRIC CONSTANT MTRLS V1 written by Hari Singh Nalwa and published by Academic Press. This book was released on 1999-08-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, et cetera, are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.

Author : Howard Huff
Publisher : Springer Science & Business Media
ISBN 13 : 9783540210818
Total Pages : 740 pages
Book Rating : 4.14/5 ( download)

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Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Author : Ramakrishna Vedula
Publisher :
ISBN 13 :
Total Pages : 102 pages
Book Rating : 4.94/5 ( download)

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Download or read book Low Dielectric Constant Materials and Processes for Interlayer Dielectric Applications written by Ramakrishna Vedula and published by . This book was released on 2006 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Mark J. Lododa
Publisher : The Electrochemical Society
ISBN 13 : 9781566772709
Total Pages : 262 pages
Book Rating : 4.02/5 ( download)

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Download or read book Low and High Dielectric Constant Materials written by Mark J. Lododa and published by The Electrochemical Society. This book was released on 2000 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.

Author :
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.75/5 ( download)

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Download or read book Low-dielectric Constant Materials written by and published by . This book was released on 1999 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Sam-Shajing Sun
Publisher : CRC Press
ISBN 13 : 1466585110
Total Pages : 1069 pages
Book Rating : 4.19/5 ( download)

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Download or read book Introduction to Organic Electronic and Optoelectronic Materials and Devices written by Sam-Shajing Sun and published by CRC Press. This book was released on 2016-10-03 with total page 1069 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the combined subjects of organic electronic and optoelectronic materials/devices. It is designed for classroom instruction at the senior college level. Highlighting emerging organic and polymeric optoelectronic materials and devices, it presents the fundamentals, principle mechanisms, representative examples, and key data.

Author : Christopher Lyle Borst
Publisher : Springer Science & Business Media
ISBN 13 : 1461511658
Total Pages : 235 pages
Book Rating : 4.56/5 ( download)

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Download or read book Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses written by Christopher Lyle Borst and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 235 pages. Available in PDF, EPUB and Kindle. Book excerpt: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Author : André Lagendijk
Publisher :
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.80/5 ( download)

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Download or read book Low-Dielectric Constant Materials II: Volume 443 written by André Lagendijk and published by . This book was released on 1997-08-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.