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Author : J. Richard Culham
Publisher :
ISBN 13 :
Total Pages : 422 pages
Book Rating : 4.14/5 ( download)
Download or read book ITherm 2000 written by J. Richard Culham and published by . This book was released on 2000 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 969 pages
Book Rating : 4.88/5 ( download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author :
Publisher : World Scientific
ISBN 13 : 9814520241
Total Pages : 1396 pages
Book Rating : 4.49/5 ( download)
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. Set 2: Thermal Packaging Tools The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Foreword Foreword (English) (42 KB) Foreword (Japanese) (342 KB) Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly e
Author : Avram Bar-Cohen
Publisher : World Scientific
ISBN 13 : 9814313785
Total Pages : 1582 pages
Book Rating : 4.80/5 ( download)
Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Author :
Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.18/5 ( download)
Download or read book ITHERM written by and published by . This book was released on 2004 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Chandra Mohan Jha
Publisher : Springer
ISBN 13 : 1493925814
Total Pages : 139 pages
Book Rating : 4.10/5 ( download)
Download or read book Thermal Sensors written by Chandra Mohan Jha and published by Springer. This book was released on 2015-04-15 with total page 139 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide to both the fundamentals of thermal sensors and their advanced functions. Key topics include sensor materials, CMOS-compatible sensors, measurement capabilities, thermal management and manufacturing processes. The introductory chapter covers the basic principles of thermal sensors from the essentials of heat transfer to smart wireless sensors. Later chapters illustrate the wide range of thermal sensor uses, from microprocessor thermal sensing to energy converter applications. Modeling and simulation techniques are used to explain the future direction of the field. Designed for researchers and practitioners working with wireless sensors and thermal management, Thermal Sensors: Principles and Applications for Semiconductor Industries is a valuable reference to the benefits and challenges these sensors offer. Advanced-level students studying mechanical or electrical engineering and networks will also find the content useful.
Author : Yogendra Joshi
Publisher : Springer Science & Business Media
ISBN 13 : 1441971246
Total Pages : 635 pages
Book Rating : 4.41/5 ( download)
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-20 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author : Naim Hamdia Afgan
Publisher : Springer Science & Business Media
ISBN 13 : 1461502969
Total Pages : 701 pages
Book Rating : 4.68/5 ( download)
Download or read book New and Renewable Technologies for Sustainable Development written by Naim Hamdia Afgan and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 701 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sustainable development encompasses economic, social, and ecological perspectives of conservation and change in natural resources. It is generally defined as development that meets the needs of the present without compromising the ability of future generations to meet their own needs. This definition is based on the ethical imperative of equity within and between generations. Moreover, apart from meeting; "the basic needs of all"; sustainable development implies sustaining the natural life support systems on Earth, and extending to all the opportunity to satisfy their aspirations for a better life. Hence, sustainable development is more precisely defined as a process of change in which the exploitation of resources, the direction of investments, the orientation of technological development, and institutional change are all in harmony and enhance both current and future potential to meet human needs and aspiration. To date, various definitions and stationary-state criteria of sustainability have been proposed. Many authors have been concerned with only part of the problem, such as the technological assumptions, the ability to substitute natural resources in economic transformation processes, and the resilience and importance of ecological processes. But, the social dimension did not receive the same attention, and has not been adequately integrated into formal analysis. The engineering community has to play an important role in sustainable development with appropriate evaluation of the engineering systems. In this respect energy, water and environment systems require multi-criteria evaluation methods for the assessment of the economic, environmental and social aspect of the systems.
Author : Gary B. Kromann
Publisher :
ISBN 13 : 9780780359130
Total Pages : pages
Book Rating : 4.35/5 ( download)
Download or read book ITherm 2000 written by Gary B. Kromann and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sanket Goel
Publisher : Elsevier
ISBN 13 : 0443154171
Total Pages : 276 pages
Book Rating : 4.71/5 ( download)
Download or read book Droplet and Digital Microfluidics written by Sanket Goel and published by Elsevier. This book was released on 2024-03-11 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Droplet and Digital Microfluidics: Ideation to Implementation is a detailed introduction to the dynamics of droplet and digital microfluidics, also featuring coverage of new methods and applications. The explosion of applications of microelectromechanical systems (MEMS) in recent years has driven demand for expertise and innovation in fluid flow in the microchannels they contain. In this book, detailed descriptions of methods for biological and chemical applications of microfluidics are provided, along with supporting foundational knowledge. In addition, the principles of droplet and digital microfluidics are explained, along with their different applications and governing physics. New additions to the technological knowledgebase that enable advances in droplet and digital microfluidics include machine learning and exciting future avenues for research. Provides step-by-step fabrication, testing, and characterization instructions in each chapter to support implementation Includes explanations of applications and methods in biological and chemical settings Describes the path to automation of digital and droplet microfluidic platforms
