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Author :
Publisher :
ISBN 13 :
Total Pages : 1150 pages
Book Rating : 4.69/5 ( download)
Download or read book ITHERM written by and published by . This book was released on 2002 with total page 1150 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : J. Richard Culham
Publisher :
ISBN 13 :
Total Pages : 422 pages
Book Rating : 4.14/5 ( download)
Download or read book ITherm 2000 written by J. Richard Culham and published by . This book was released on 2000 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cristina H. Amon
Publisher :
ISBN 13 :
Total Pages : 1148 pages
Book Rating : 4.16/5 ( download)
Download or read book ITherm 2002 written by Cristina H. Amon and published by . This book was released on 2002 with total page 1148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hwaiyu Geng
Publisher : John Wiley & Sons
ISBN 13 : 1118937589
Total Pages : 720 pages
Book Rating : 4.87/5 ( download)
Download or read book Data Center Handbook written by Hwaiyu Geng and published by John Wiley & Sons. This book was released on 2014-12-01 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.
Author : Madhusudan Iyengar
Publisher : World Scientific
ISBN 13 : 9814579807
Total Pages : 472 pages
Book Rating : 4.03/5 ( download)
Download or read book Cooling of Microelectronic and Nanoelectronic Equipment written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging. Contents:A Review of Cooling Road Maps for 3D Chip Packages (Dereje Agonafer)Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks (Karl J L Geisler and Avram Bar-Cohen)Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency (Bing Shi and Ankur Srivastava)Energy Reduction and Performance Maximization Through Improved Cooling (David Copeland)Optimal Choice of Heat Sinks from an Industrial Point of View (Clemens J M Lasance)Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems (Mehmet Arik and Enes Tamdogan)Recent Advance in Thermoelectric Devices for Electronics Cooling (Peng Wang)Energy Efficient Solid-State Cooling for Hot Spot Removal (Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri)An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges (Amy S Fleischer)Estimation of Cooling Performance of Phase Change Material (PCM) Module (Masaru Ishizuka and Tomoyuki Hatakeyama)Optimization Under Uncertainty for Electronics Cooling Design (Karthik K Bodla, Jayathi Y Murthy and Suresh V Garimella)Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling (Glen A Powell, Anuradha Bulusu, Justin A Weibel, Sungwon S Kim, Suresh V Garimella and Timothy S Fisher)A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (Qihong Nie and Yogendra Joshi)Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management (Jun Dai, Michael Ohadi and Michael Pecht)Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics (Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones)Towards Embedded Cooling — Gen 3 Thermal Packaging Technology (Avram Bar-Cohen) Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering. Keywords:Electronics Cooling;Electronics Packaging;Thermal Management;Thermal Sciences;Electronics Reliability;Thermoelectrics;Computational Heat Transfer;Liquid Cooling
Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556651
Total Pages : 462 pages
Book Rating : 4.57/5 ( download)
Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-03 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author : Mohamed, Ahmed Thabet
Publisher : IGI Global
ISBN 13 : 1799838307
Total Pages : 363 pages
Book Rating : 4.02/5 ( download)
Download or read book Design and Investment of High Voltage NanoDielectrics written by Mohamed, Ahmed Thabet and published by IGI Global. This book was released on 2020-08-21 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnology has emerged as a trending research area as its industrial uses continue to multiply. Some specific areas that have benefited from the dynamic properties of nanomaterials are high voltage electronics and electrical engineering. Nanoparticles have created new avenues for engineers to explore within these fields; however, significant research on this subject is lacking. Design and Investment of High Voltage NanoDielectrics is a collection of innovative research on the methods and application of nanoparticles in high voltage insulations and dielectric properties. This book discusses the wide array of uses nanoparticles have within high voltage electrics engineering and the diverse polymeric properties that nanomaterials help make prevalent. While highlighting topics including electrical degradation, magnetic materials, and fundamental polymers, this book is ideally designed for researchers, engineers, industry professionals, practitioners, scientists, managers, manufacturers, analysts, students, and educators seeking current research on the dielectric properties of modern nanocomposite materials.
Author : Madhusudan Iyengar
Publisher : World Scientific
ISBN 13 : 9811279381
Total Pages : 479 pages
Book Rating : 4.86/5 ( download)
Download or read book Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Author : Royal Society (Great Britain)
Publisher :
ISBN 13 :
Total Pages : 756 pages
Book Rating : 4.10/5 ( download)
Download or read book Proceedings of the Royal Society of London written by Royal Society (Great Britain) and published by . This book was released on 1926 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publishes research papers in the mathematical and physical sciences. Continued by: Proceedings. Mathematical and physical sciences; and, Proceedings. Mathematical, physical, and engineering sciences.
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.17/5 ( download)
Download or read book I-THERM IV written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1994 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
