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Author : ASM International
Publisher : ASM International(OH)
ISBN 13 : 9780871708632
Total Pages : 356 pages
Book Rating : 4.39/5 ( download)
Download or read book ISTFA 2007 written by ASM International and published by ASM International(OH). This book was released on 2007 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030905
Total Pages : 372 pages
Book Rating : 4.03/5 ( download)
Download or read book ISTFA 2007 Proceedings of the 33rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2007-01-01 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author : ASM International
Publisher :
ISBN 13 : 9781627081504
Total Pages : 660 pages
Book Rating : 4.0X/5 ( download)
Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by ASM International and published by . This book was released on 2017-12 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference is Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author :
Publisher : ASM International
ISBN 13 : 1615030921
Total Pages : 371 pages
Book Rating : 4.27/5 ( download)
Download or read book ISTFA 2009 written by and published by ASM International. This book was released on 2009-01-01 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Author :
Publisher : ASM International
ISBN 13 : 1615037276
Total Pages : 487 pages
Book Rating : 4.78/5 ( download)
Download or read book ISTFA 2010 written by and published by ASM International. This book was released on 2010-01-01 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030913
Total Pages : 551 pages
Book Rating : 4.10/5 ( download)
Download or read book Thirty-fourth International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2008-01-01 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 1615038507
Total Pages : 479 pages
Book Rating : 4.03/5 ( download)
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 750 pages
Book Rating : 4.64/5 ( download)
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author : A. S. M. International
Publisher : ASM International
ISBN 13 : 1627080740
Total Pages : 561 pages
Book Rating : 4.43/5 ( download)
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author :
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.30/5 ( download)
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
