Epeps 2010

Author : Manho Lee
Publisher : Springer
ISBN 13 : 9401790388
Total Pages : 280 pages
Book Rating : 4.83/5 ( download)

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Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 529 pages
Book Rating : 4.95/5 ( download)

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Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Author : Nadine Collaert
Publisher : Elsevier
ISBN 13 : 0128234504
Total Pages : 369 pages
Book Rating : 4.01/5 ( download)

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Download or read book New Materials and Devices Enabling 5G Applications and Beyond written by Nadine Collaert and published by Elsevier. This book was released on 2024-01-24 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) Focuses on mm-wave frequencies up to the terahertz regime

Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.66/5 ( download)

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Download or read book The Philippine Strategy on Climate Change Adaptation, 2010-2022 written by and published by . This book was released on 2010 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Er-Ping Li
Publisher : John Wiley & Sons
ISBN 13 : 1118166744
Total Pages : 394 pages
Book Rating : 4.41/5 ( download)

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Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-03-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Author : Theodore S. Rappaport
Publisher : Prentice Hall
ISBN 13 : 0132173689
Total Pages : 705 pages
Book Rating : 4.81/5 ( download)

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Download or read book Millimeter Wave Wireless Communications written by Theodore S. Rappaport and published by Prentice Hall. This book was released on 2014-09-09 with total page 705 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave applications, devices, and networks will change our world. In Millimeter Wave Wireless Communications, four of the field's pioneers, including Theodore S. Rappaport, Robert W. Heath, Robert C. Daniels, and James N. Murdock, draw on their vast experience to empower engineers at all levels to succeed with mmWave. They deliver fundamental, end-to-end coverage of all aspects of future mmWave wireless communications systems. The authors explain new multi-Gigabit per second products and applications, mmWave signal propagation, analog and digital circuit design, mmWave antenna designs, and current and emerging wireless standards. They cover comprehensive mmWave wireless design issues for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor channel models and beam combining Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)

Author : Madhavan Swaminathan
Publisher : World Scientific
ISBN 13 : 9814508616
Total Pages : 379 pages
Book Rating : 4.12/5 ( download)

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Download or read book Design And Modeling For 3d Ics And Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Author : Larry D. Smith
Publisher : Prentice Hall
ISBN 13 : 0132735628
Total Pages : 831 pages
Book Rating : 4.29/5 ( download)

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Download or read book Principles of Power Integrity for PDN Design--Simplified written by Larry D. Smith and published by Prentice Hall. This book was released on 2017-04-06 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.

Author : George A. Tsihrintzis
Publisher : Springer
ISBN 13 : 3030156281
Total Pages : 548 pages
Book Rating : 4.82/5 ( download)

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Download or read book Machine Learning Paradigms written by George A. Tsihrintzis and published by Springer. This book was released on 2019-07-06 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the inaugural volume in the new Springer series on Learning and Analytics in Intelligent Systems. The series aims at providing, in hard-copy and soft-copy form, books on all aspects of learning, analytics, advanced intelligent systems and related technologies. These disciplines are strongly related and mutually complementary; accordingly, the new series encourages an integrated approach to themes and topics in these disciplines, which will result in significant cross-fertilization, research advances and new knowledge creation. To maximize the dissemination of research findings, the series will publish edited books, monographs, handbooks, textbooks and conference proceedings. This book is intended for professors, researchers, scientists, engineers and students. An extensive list of references at the end of each chapter allows readers to probe further into those application areas that interest them most.

Author : Thierry Roncalli
Publisher : CRC Press
ISBN 13 : 1351385224
Total Pages : 987 pages
Book Rating : 4.20/5 ( download)

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Download or read book Handbook of Financial Risk Management written by Thierry Roncalli and published by CRC Press. This book was released on 2020-04-23 with total page 987 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developed over 20 years of teaching academic courses, the Handbook of Financial Risk Management can be divided into two main parts: risk management in the financial sector; and a discussion of the mathematical and statistical tools used in risk management. This comprehensive text offers readers the chance to develop a sound understanding of financial products and the mathematical models that drive them, exploring in detail where the risks are and how to manage them. Key Features: Written by an author with both theoretical and applied experience Ideal resource for students pursuing a master’s degree in finance who want to learn risk management Comprehensive coverage of the key topics in financial risk management Contains 114 exercises, with solutions provided online at www.crcpress.com/9781138501874