Encyclopedia Of Packaging Materials Processes And Mechanics

Author : Avram Bar-Cohen
Publisher : World Scientific
ISBN 13 : 9811209634
Total Pages : 1079 pages
Book Rating : 4.35/5 ( download)

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Download or read book Encyclopedia of Packaging Materials, Processes, and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Author : Kit L. Yam
Publisher : John Wiley & Sons
ISBN 13 : 0470541385
Total Pages : 1368 pages
Book Rating : 4.88/5 ( download)

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Download or read book The Wiley Encyclopedia of Packaging Technology written by Kit L. Yam and published by John Wiley & Sons. This book was released on 2010-01-05 with total page 1368 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference

Author : Marilyn Bakker
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 768 pages
Book Rating : 4.3C/5 ( download)

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Download or read book The Wiley Encyclopedia of Packaging Technology written by Marilyn Bakker and published by Wiley-Interscience. This book was released on 1986-09-22 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Wiley Encyclopedia of Packaging Technology Packaging technology is of vital importance in all manufacturing industries. The Wiley Encyclopedia of Packaging Technology is designed to provide a comprehensive reference incorporating 188 topics from "Acrylics" to "Zero-Crush Concept" for a wide audience of engineers, technologists, and scientists who seek an introduction to unfamiliar aspects of the packaging process. In addition to providing an exhaustive reference for packaging engineers, the book is also designed to serve, for example, polymer chemists developing new products. It will also meet a need in all technical libraries for an authoritative basic reference on packaging. The 188 entries have been written by 225 acknowledged experts in academia and industry, and each has been reviewed by other experts in the field for completeness and objectivity. This encyclopedia provides coverage of all stages of the packaging process from raw materials through distribution. Multiple articles are included on all major topics, such as bags, boxes, cans, cartons, coextrusion machinery, decorating, filling machinery, films, plastics, steel, and testing. A significant contribution to packaging literature, this encyclopedia brings together in a single volume expertise from many disciplines. It contains many landmark articles, such as blow molding, corrugated boxes, fabricated cans, steel cans, economics of packaging, glass container design, glass container manufacturing, indicating devices, multilayer flexible packaging, paper, specifications and quality assurance, and international standards and practices. Numerous bibliographies accompany the articles. In addition, the encyclopedia includes over 200 tables and nearly 600 figures—all prepared with the cooperation of a distinguished Advisory Board. The result is a unique, informative work that will serve the diverse interests and concerns of those in the field of packaging with authoritative, reliable, state-of-the-art information of the subject.

Author : Anne Emblem
Publisher : Elsevier
ISBN 13 : 0857095706
Total Pages : 601 pages
Book Rating : 4.01/5 ( download)

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Download or read book Packaging Technology written by Anne Emblem and published by Elsevier. This book was released on 2012-10-29 with total page 601 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals. Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging. With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. Provides the ideal introduction and reference for both students and experienced packaging professionals Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board

Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.49/5 ( download)

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Download or read book Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging written by and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Bar-cohen Avram
Publisher : World Scientific
ISBN 13 : 9813239689
Total Pages : 904 pages
Book Rating : 4.85/5 ( download)

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Download or read book Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set) written by Bar-cohen Avram and published by World Scientific. This book was released on 2018-10-15 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.Set 3: Thermal Packaging ApplicationsThe third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.

Author : Karl J. L. Geisler
Publisher : World Scientific Publishing Company
ISBN 13 : 9789814313827
Total Pages : 388 pages
Book Rating : 4.23/5 ( download)

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Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components written by Karl J. L. Geisler and published by World Scientific Publishing Company. This book was released on 2012-12-12 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Foreword(s)Foreword (English) (85 KB)Foreword (Japanese) (342 KB)

Author :
Publisher : World Scientific
ISBN 13 : 9814452599
Total Pages : 1582 pages
Book Rating : 4.95/5 ( download)

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Download or read book Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Author : Ken Gilleo
Publisher : McGraw-Hill
ISBN 13 : 9780071738002
Total Pages : 176 pages
Book Rating : 4.02/5 ( download)

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Download or read book Area Array Packaging Materials written by Ken Gilleo and published by McGraw-Hill. This book was released on 2003-10 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Processes includes vital information necessary for the manufacture of cutting-edge electronics products.

Author :
Publisher :
ISBN 13 :
Total Pages : 668 pages
Book Rating : 4.44/5 ( download)

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Download or read book Modern Packaging Encyclopedia written by and published by . This book was released on 1971 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt: