Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two Phase Convection

Author : Madhusudan Iyengar
Publisher : World Scientific
ISBN 13 : 9811279381
Total Pages : 479 pages
Book Rating : 4.86/5 ( download)

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Download or read book Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Author : Sung Jin Kim
Publisher : CRC Press
ISBN 13 : 1000108597
Total Pages : 260 pages
Book Rating : 4.90/5 ( download)

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Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

Author : Frank P. Incropera
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.46/5 ( download)

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Download or read book Liquid Cooling of Electronic Devices by Single-Phase Convection written by Frank P. Incropera and published by Wiley-Interscience. This book was released on 1999-05-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.

Author : S. M. Sohel Murshed
Publisher : BoD – Books on Demand
ISBN 13 : 9535124056
Total Pages : 184 pages
Book Rating : 4.54/5 ( download)

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Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Author : Allan W. Scott
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.96/5 ( download)

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Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author :
Publisher : Springer
ISBN 13 : 9783319266947
Total Pages : 0 pages
Book Rating : 4.42/5 ( download)

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Download or read book Handbook of Thermal Science and Engineering written by and published by Springer. This book was released on 2018-07-31 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.

Author : Ralph Remsburg
Publisher : CRC Press
ISBN 13 : 1351835912
Total Pages : 400 pages
Book Rating : 4.16/5 ( download)

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Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Author : Cornell Aeronautical Laboratory
Publisher :
ISBN 13 :
Total Pages : 220 pages
Book Rating : 4.79/5 ( download)

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Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : L. P. Yarin
Publisher : Springer Science & Business Media
ISBN 13 : 3540787550
Total Pages : 487 pages
Book Rating : 4.56/5 ( download)

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Download or read book Fluid Flow, Heat Transfer and Boiling in Micro-Channels written by L. P. Yarin and published by Springer Science & Business Media. This book was released on 2008-09-19 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.

Author : Guang-Jyh Hwang
Publisher : CRC Press
ISBN 13 : 9780891168881
Total Pages : 822 pages
Book Rating : 4.85/5 ( download)

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Download or read book Transport Phenomena In Thermal Control written by Guang-Jyh Hwang and published by CRC Press. This book was released on 1989-08-01 with total page 822 pages. Available in PDF, EPUB and Kindle. Book excerpt: A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.