Electrothermal Analysis Of Vlsi Systems

Author : Yi-Kan Cheng
Publisher : Springer Science & Business Media
ISBN 13 : 0306470241
Total Pages : 220 pages
Book Rating : 4.40/5 ( download)

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Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2005-12-01 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Author :
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.03/5 ( download)

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Download or read book Electrothermal Analysis of VLSI Systems written by and published by . This book was released on 2000 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 303943831X
Total Pages : 310 pages
Book Rating : 4.10/5 ( download)

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Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Author : J. Altet
Publisher : Springer Science & Business Media
ISBN 13 : 1475736355
Total Pages : 212 pages
Book Rating : 4.59/5 ( download)

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Download or read book Thermal Testing of Integrated Circuits written by J. Altet and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Author : Blaise Ravelo
Publisher : Springer Nature
ISBN 13 : 9811505527
Total Pages : 233 pages
Book Rating : 4.22/5 ( download)

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Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

Author : Shahrzad Salemi
Publisher : RIAC
ISBN 13 : 1933904291
Total Pages : 271 pages
Book Rating : 4.90/5 ( download)

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Download or read book Physics-of-Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Hang Li
Publisher :
ISBN 13 :
Total Pages : 258 pages
Book Rating : 4.77/5 ( download)

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Download or read book Power and Thermal Integrity Analysis and Optimization for Nanometer VLSI Systems written by Hang Li and published by . This book was released on 2007 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Joseph Bernstein
Publisher : Academic Press
ISBN 13 : 0128008199
Total Pages : 108 pages
Book Rating : 4.95/5 ( download)

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Download or read book Reliability Prediction from Burn-In Data Fit to Reliability Models written by Joseph Bernstein and published by Academic Press. This book was released on 2014-03-06 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. The ability to include reliability calculations and test results in their product design The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions Have accurate failure rate calculations for calculating warrantee period replacement costs

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ISBN 13 :
Total Pages : 940 pages
Book Rating : 4.17/5 ( download)

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Download or read book APCCAS ... written by and published by . This book was released on 2000 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Luis R.J. Costa
Publisher : Springer Science & Business Media
ISBN 13 : 3642122949
Total Pages : 610 pages
Book Rating : 4.41/5 ( download)

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Download or read book Scientific Computing in Electrical Engineering SCEE 2008 written by Luis R.J. Costa and published by Springer Science & Business Media. This book was released on 2010-06-14 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of 65 selected papers presented at the 7th International Conference on Scientific Computing in Electrical Engineering (SCEE), held in Espoo, Finland, in 2008. The aim of the SCEE 2008 conference was to bring together scientists from academia and industry, e.g. mathematicians, electrical engineers, computer scientists, and physicists, with the goal of intensive discussions on industrially relevant mathematical problems, with an emphasis on modeling and numerical simulation of electronic circuits and devices, electromagnetic fields, and coupled problems.This extensive reference work is divided into five parts: 1. Computational electromagnetics, 2. Circuit simulation, 3. Coupled problems, 4. Mathematical and computational methods, and 5. Model-order reduction. Each part starts with an general introduction followed by the actual papers.