Dielectric Breakdown In Gigascale Electronics

Author : Juan Pablo Borja
Publisher : Springer
ISBN 13 : 3319432206
Total Pages : 109 pages
Book Rating : 4.05/5 ( download)

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Download or read book Dielectric Breakdown in Gigascale Electronics written by Juan Pablo Borja and published by Springer. This book was released on 2016-09-16 with total page 109 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.

Author : Ming He
Publisher : Springer Science & Business Media
ISBN 13 : 1461418127
Total Pages : 155 pages
Book Rating : 4.22/5 ( download)

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Download or read book Metal-Dielectric Interfaces in Gigascale Electronics written by Ming He and published by Springer Science & Business Media. This book was released on 2012-02-02 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.43/5 ( download)

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Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Author : Jeffrey A. Davis
Publisher : Springer Science & Business Media
ISBN 13 : 1461504619
Total Pages : 417 pages
Book Rating : 4.10/5 ( download)

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Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Author :
Publisher :
ISBN 13 :
Total Pages : 304 pages
Book Rating : 4.91/5 ( download)

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Download or read book Dielectric Breakdown written by and published by . This book was released on 1990 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : James Charles Espinosa
Publisher :
ISBN 13 :
Total Pages : 246 pages
Book Rating : 4.76/5 ( download)

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Download or read book Dielectric breakdown of water written by James Charles Espinosa and published by . This book was released on 2000 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Titu I. Băjenescu
Publisher : Artech House
ISBN 13 : 1596934360
Total Pages : 706 pages
Book Rating : 4.68/5 ( download)

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Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Author : Titu I. Bajenescu
Publisher : Springer Science & Business Media
ISBN 13 : 3642585051
Total Pages : 547 pages
Book Rating : 4.50/5 ( download)

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Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Author : Austin S. Norcross
Publisher :
ISBN 13 :
Total Pages : 170 pages
Book Rating : 4.56/5 ( download)

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Download or read book Three Mechanisms of Dielectric Breakdown written by Austin S. Norcross and published by . This book was released on 1929 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Jeffrey Boksiner
Publisher :
ISBN 13 :
Total Pages : 220 pages
Book Rating : 4.26/5 ( download)

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Download or read book Dielectric Breakdown in Media with Defeats written by Jeffrey Boksiner and published by . This book was released on 2003 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: