Adhesion In Microelectronics

Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1118831349
Total Pages : 293 pages
Book Rating : 4.42/5 ( download)

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Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Author : James J. Licari
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.08/5 ( download)

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Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages

Author : Xiang Dai
Publisher :
ISBN 13 :
Total Pages : 328 pages
Book Rating : 4.51/5 ( download)

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Download or read book Materials study for interfacial adhesion and reliability of microelectronics packaging structures written by Xiang Dai and published by . This book was released on 1998 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : B. G. Yacobi
Publisher : American Scientific Publishers
ISBN 13 :
Total Pages : 200 pages
Book Rating : 4.78/5 ( download)

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Download or read book Adhesive Bonding in Photonics Assembly and Packaging written by B. G. Yacobi and published by American Scientific Publishers. This book was released on 2003 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : George G. Harman
Publisher : McGraw Hill Professional
ISBN 13 : 9780070326194
Total Pages : 290 pages
Book Rating : 4.93/5 ( download)

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Download or read book Ire Bonding in Microelectronics written by George G. Harman and published by McGraw Hill Professional. This book was released on 1997 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch

Author : A. Christou
Publisher : RIAC
ISBN 13 : 1933904151
Total Pages : 410 pages
Book Rating : 4.53/5 ( download)

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Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Tomi Laurila
Publisher : Springer Science & Business Media
ISBN 13 : 1447124707
Total Pages : 221 pages
Book Rating : 4.02/5 ( download)

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Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-10 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.

Author : George G. Harman
Publisher :
ISBN 13 :
Total Pages : 116 pages
Book Rating : 4.28/5 ( download)

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Download or read book Microelectronic Ultrasonic Bonding written by George G. Harman and published by . This book was released on 1974 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Helmut Baumgart
Publisher : The Electrochemical Society
ISBN 13 : 156677506X
Total Pages : 398 pages
Book Rating : 4.69/5 ( download)

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Download or read book Semiconductor Wafer Bonding 9: Science, Technology, and Applications written by Helmut Baumgart and published by The Electrochemical Society. This book was released on 2006 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.

Author : Charles E. Hunt
Publisher : The Electrochemical Society
ISBN 13 : 9781566772587
Total Pages : 496 pages
Book Rating : 4.83/5 ( download)

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Download or read book Semiconductor Wafer Bonding : Science, Technology, and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: