Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics

Author : Philip Y. Paik
Publisher : Artech House Publishers
ISBN 13 :
Total Pages : 216 pages
Book Rating : 4.78/5 ( download)

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Download or read book Adaptive Cooling of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and published by Artech House Publishers. This book was released on 2007 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Author : Dan E. Angelescu
Publisher : Artech House
ISBN 13 : 159693980X
Total Pages : 269 pages
Book Rating : 4.06/5 ( download)

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Download or read book Highly Integrated Microfluidics Design written by Dan E. Angelescu and published by Artech House. This book was released on 2011 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent development of microfluidics has lead to the concept of lab-on-a-chip, where several functional blocks are combined into a single device that can perform complex manipulations and characterizations on the microscopic fluid sample. However, integration of multiple functionalities on a single device can be complicated. This a cutting-edge resource focuses on the crucial aspects of integration in microfluidic systems. It serves as a one-stop guide to designing microfluidic systems that are highly integrated and scalable. This practical book covers a wide range of critical topics, from fabrication techniques and simulation tools, to actuation and sensing functional blocks and their inter-compatibility. This unique reference outlines the benefits and drawbacks of different approaches to microfluidic integration and provides a number of clear examples of highly integrated microfluidic systems.

Author : Yang Zhao
Publisher : Springer Science & Business Media
ISBN 13 : 1461403707
Total Pages : 207 pages
Book Rating : 4.08/5 ( download)

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Download or read book Design and Testing of Digital Microfluidic Biochips written by Yang Zhao and published by Springer Science & Business Media. This book was released on 2012-07-25 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive methodology for automated design, test and diagnosis, and use of robust, low-cost, and manufacturable digital microfluidic systems. It focuses on the development of a comprehensive CAD optimization framework for digital microfluidic biochips that unifies different design problems. With the increase in system complexity and integration levels, biochip designers can utilize the design methods described in this book to evaluate different design alternatives, and carry out design-space exploration to obtain the best design point.

Author : Hafiz Muhammad Ali
Publisher : BoD – Books on Demand
ISBN 13 : 1803566396
Total Pages : 200 pages
Book Rating : 4.99/5 ( download)

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Download or read book Heat Transfer written by Hafiz Muhammad Ali and published by BoD – Books on Demand. This book was released on 2024-02-14 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Transfer - Advances in Fundamentals and Applications explores new knowledge in the domain of fundamental and applied advances in heat transfer. This book specifically emphasizes advanced topics of heat transfer. Professionals, researchers, and academics working in various areas of heat transfer will find this a useful reference for finding new solutions to heat transfer problems. The book is organized into two sections on the fundamental advances in heat transfer and advances in applications of heat transfer. Chapters address inverse conduction problems, heat transfer enhancement during internal flows, shell-and-tube heat exchangers, heat transfer mechanisms in petroleum and geothermal wellbores, and other topics in the field.

Author : Saptarshi Basu
Publisher : Springer
ISBN 13 : 9811072337
Total Pages : 379 pages
Book Rating : 4.38/5 ( download)

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Download or read book Droplet and Spray Transport: Paradigms and Applications written by Saptarshi Basu and published by Springer. This book was released on 2017-12-12 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on droplets and sprays and their applications. It discusses how droplet level transport is central to a multitude of applications and how droplet level manipulation and control can enhance the efficiency and design of multiphase systems. Droplets and sprays are ubiquitous in a variety of multiphase and multiscale applications in surface patterning, oil recovery, combustion, atomization, spray drying, thermal barrier coating, renewable energy, and electronic cooling, to name but a few. This book provides two levels of details pertaining to such applications. Each chapter delves into a specific application and provides not only an overview but also detailed physical insights into the application mechanism from the point of view of droplets and sprays. All chapters provide a mix of cutting-edge applications, new diagnostic techniques and modern computational methodologies, as well as the fundamental physical mechanism involved in each application. Taken together, the chapters provide a translational perspective on these applications, from basic transport processes to optimization, and from design to implementation using droplets or sprays as fundamental building blocks. Given its breadth of coverage, the book will be of interest to students, researchers, and industry professionals alike.

Author : Lee Yung-cheng
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 364 pages
Book Rating : 4.72/5 ( download)

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Download or read book Mems Packaging written by Lee Yung-cheng and published by World Scientific. This book was released on 2018-01-03 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics

Author : Yujun Song
Publisher : John Wiley & Sons
ISBN 13 : 352780062X
Total Pages : 352 pages
Book Rating : 4.29/5 ( download)

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Download or read book Microfluidics written by Yujun Song and published by John Wiley & Sons. This book was released on 2018-01-04 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book offering a global overview of fundamental microfluidics and the wide range of possible applications, for example, in chemistry, biology, and biomedical science. As such, it summarizes recent progress in microfluidics, including its origin and development, the theoretical fundamentals, and fabrication techniques for microfluidic devices. The book also comprehensively covers the fluid mechanics, physics and chemistry as well as applications in such different fields as detection and synthesis of inorganic and organic materials. A useful reference for non-specialists and a basic guideline for research scientists and technicians already active in this field or intending to work in microfluidics.

Author : Krzysztof Iniewski
Publisher : Artech House
ISBN 13 : 1596933186
Total Pages : 453 pages
Book Rating : 4.87/5 ( download)

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Download or read book VLSI Circuits for Biomedical Applications written by Krzysztof Iniewski and published by Artech House. This book was released on 2008 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supported with over 280 illustrations and over 160 equations, the book offers cutting-edge guidance on designing integrated circuits for wireless biosensing, body implants, biosensing interfaces, and molecular biology. You discover innovative design techniques and novel materials to help you achieve higher levels circuit and system performance.

Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.70/5 ( download)

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Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Author : Humberto Campanella
Publisher : Artech House
ISBN 13 : 1607839784
Total Pages : 364 pages
Book Rating : 4.81/5 ( download)

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Download or read book Acoustic Wave and Electromechanical Resonators written by Humberto Campanella and published by Artech House. This book was released on 2010 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: This groundbreaking book provides you with a comprehensive understanding of FBAR (thin-film bulk acoustic wave resonator), MEMS (microelectomechanical system), and NEMS (nanoelectromechanical system) resonators. For the first time anywhere, you find extensive coverage of these devices at both the technology and application levels. This practical reference offers you guidance in design, fabrication, and characterization of FBARs, MEMS and NEBS. It discusses the integration of these devices with standard CMOS (complementary-metal-oxide-semiconductor) technologies, and their application to sensing and RF systems. Moreover, this one-stop resource looks at the main characteristics, differences, and limitations of FBAR, MEMS, and NEMS devices, helping you to choose the right approaches for your projects. Over 280 illustrations and more than 130 equations support key topics throughout the book.