2020 Ieee 22nd Electronics Packaging Technology Conference Eptc

Author : IEEE Staff
Publisher :
ISBN 13 : 9781728189123
Total Pages : pages
Book Rating : 4.28/5 ( download)

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Download or read book 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) written by IEEE Staff and published by . This book was released on 2020-12-02 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPTC 2020 will feature keynotes, technical sessions, short courses, forums, exhibitions, social and networking activities It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world EPTC is the flagship conference of IEEE EPS in Region 10

Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.86/5 ( download)

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Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.43/5 ( download)

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Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Author : Xiaobing Luo
Publisher : John Wiley & Sons
ISBN 13 : 1119179297
Total Pages : 373 pages
Book Rating : 4.90/5 ( download)

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Download or read book Thermal Management for Opto-electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Author : Peng Yu
Publisher : John Wiley & Sons
ISBN 13 : 352734912X
Total Pages : 389 pages
Book Rating : 4.28/5 ( download)

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Download or read book Integrated Nanophotonics written by Peng Yu and published by John Wiley & Sons. This book was released on 2023-08-14 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Helps readers understand the important advances in nanophotonics materials development and their latest applications This book introduces the current state of and emerging trends in the development of integrated nanophotonics. Written by three well-qualified authors, it systematically reviews the knowledge of integrated nanophotonics from theory to the most recent technological developments. It also covers the applications of integrated nanophotonics in essential areas such as neuromorphic computing, biosensing, and optical communications. Lastly, it brings together the latest advancements in the key principles of photonic integrated circuits, plus the recent advances in tackling the barriers in photonic integrated circuits. Sample topics included in this comprehensive resource include: Platforms for integrated nanophotonics, including lithium niobate nanophotonics, indium phosphide nanophotonics, silicon nanophotonics, and nonlinear optics for integrated photonics The devices and technologies for integrated nanophotonics in on-chip light sources, optical packaging of photonic integrated circuits, optical interconnects, and light processing devices Applications on neuromorphic computing, biosensing, LIDAR, and computing for AI and artificial neural network and deep learning Materials scientists, physicists, and physical chemists can use this book to understand the totality of cutting-edge theory, research, and applications in the field of integrated nanophotonics.

Author :
Publisher :
ISBN 13 : 9781538630426
Total Pages : pages
Book Rating : 4.27/5 ( download)

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Download or read book EPTC written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : IEEE Staff
Publisher :
ISBN 13 : 9781538630433
Total Pages : pages
Book Rating : 4.35/5 ( download)

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Download or read book 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) written by IEEE Staff and published by . This book was released on 2017-12-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging Advanced Flip chip, 2 5D & 3D, PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter wave, Power and Rugged Electronics Packaging etc TSV Wafer Level Packaging Wafer level packaging ( Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Processing advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, etc

Author : IEEE Staff
Publisher :
ISBN 13 : 9781728161624
Total Pages : pages
Book Rating : 4.22/5 ( download)

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Download or read book 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) written by IEEE Staff and published by . This book was released on 2020-10-05 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society

Author :
Publisher :
ISBN 13 : 9781728168265
Total Pages : pages
Book Rating : 4.60/5 ( download)

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Download or read book 2020 21st International Conference on Electronic Packaging Technology (ICEPT). written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Components, Packaging, and Manufacturing Technology Society
Publisher :
ISBN 13 : 9781457719837
Total Pages : 838 pages
Book Rating : 4.35/5 ( download)

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Download or read book 2011 IEEE 13th Electronics Packaging Technology Conference written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2011-12-10 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt: