2016 17th International Conference On Electronic Packaging Technology Icept

Author : IEEE Staff
Publisher :
ISBN 13 : 9781509013975
Total Pages : pages
Book Rating : 4.70/5 ( download)

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Download or read book 2016 17th International Conference on Electronic Packaging Technology (ICEPT) written by IEEE Staff and published by . This book was released on 2016-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2016 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China

Author : Keyun Bi
Publisher :
ISBN 13 : 9781509013968
Total Pages : pages
Book Rating : 4.62/5 ( download)

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Download or read book The 17th International Conference on Electronic Packaging Technology written by Keyun Bi and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author :
Publisher :
ISBN 13 : 9781665413916
Total Pages : pages
Book Rating : 4.13/5 ( download)

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Download or read book 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author :
Publisher :
ISBN 13 : 9781728168265
Total Pages : pages
Book Rating : 4.60/5 ( download)

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Download or read book 2020 21st International Conference on Electronic Packaging Technology (ICEPT). written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 3030934411
Total Pages : 332 pages
Book Rating : 4.15/5 ( download)

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Download or read book Recent Progress in Lead-Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Author : IEEE Staff
Publisher :
ISBN 13 : 9781479904990
Total Pages : pages
Book Rating : 4.96/5 ( download)

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Download or read book 2013 14th International Conference on Electronic Packaging Technology (ICEPT) written by IEEE Staff and published by . This book was released on 2013-08-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Author : Ahmed Sharif
Publisher : John Wiley & Sons
ISBN 13 : 3527344195
Total Pages : 398 pages
Book Rating : 4.92/5 ( download)

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Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Author : Frank Suli
Publisher : Woodhead Publishing
ISBN 13 : 008102391X
Total Pages : 490 pages
Book Rating : 4.14/5 ( download)

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Download or read book Electronic Enclosures, Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Author :
Publisher : World Scientific
ISBN 13 : 9811209642
Total Pages : 1079 pages
Book Rating : 4.42/5 ( download)

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Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Author : Mohammad Abdul Matin
Publisher : Springer Nature
ISBN 13 : 303074311X
Total Pages : 448 pages
Book Rating : 4.16/5 ( download)

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Download or read book Wideband, Multiband, and Smart Antenna Systems written by Mohammad Abdul Matin and published by Springer Nature. This book was released on 2021-09-21 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides current R&D trends and novel approaches in design and analysis of broadband, multiband, and smart antennas for 5G and B5G mobile and wireless applications, as well as the identification of integration techniques of these antennas in a diverse range of devices. The book presents theoretical and experimental approaches to help the reader in understanding the unique design issues and more advanced research. Moreover, the book includes chapters on the fundamentals of antenna theory. The book is pertinent to professionals and researchers working in the field of antenna engineering; it is written for graduate students, researchers, academics, and industry practitioners who want to improve their understanding in the current research trends in design analysis of broadband, multiband, and smart antennas for wireless applications.